Accessory Compatibility
Recommended | Not Recommended | |
Build Plate | Cool Plate, High Temperature Plate or Textured PEI Plate | Engineering Plate |
Hotend | All Size / Material | / |
Glue | Bambu Liquid Glue Glue Stick |
/ |
Recommended Printing Settings | |
Drying Settings (Blast Drying Oven) | 55 °C,8 h |
Printing and Keeping Container’s Humidity | < 20% RH (Sealed, with Desiccant) |
Nozzle Temperature | 190 – 230 °C |
Bed Temperature (with Glue) | 35 – 45 °C |
Printing Speed | < 300 mm/s |
Physical Properties | |
Density | 1.24 g/cm³ |
Vicat Softening Temperature | 57 °C |
Heat Deflection Temperature | 57 °C |
Melting Temperature | 160 °C |
Melt Index | 42.4 ± 3.5 g/10 min |
Mechanical Properties | |
Tensile Strength | 35 ± 4 MPa |
Breaking Elongation Rate | 12.2 ± 1.8 % |
Bending Modulus | 2750 ± 160 MPa |
Bending Strength | 76 ± 5 MPa |
Impact Strength | 26.6 ± 2.8 kJ/m² |
Printing Tips
• For better print results, please reduce the Max volumetric speed from 21 mm³/s to 15 mm³/s when printing PLA Basic Silver/Gold/Bronze.
• Drying conditions: 55℃ for 8 hrs. Store in a dry environment after use. Dry before use if the material absorbs moisture. For more details please refer to: Filament drying instructions on WIKI.